Monitor method and apparatus for overlay alignment of a stepper

Details Monitor method and apparatus for overlay alignment of a stepper Monitor method and apparatus for overlay alignment of a stepper

1999-05-12

2000-10-03

Lee, Eddie C.

Photocopying

Projection printing and copying cameras

Step and repeat

355 77, 430 22, 430 30, G03B 2742, G03B 2732, G03C 900, G03C 500

Patent

active

061280704

ABSTRACT:
A monitor method and apparatus for overlay alignment of a stepper includes a reticle having a plurality of align marks for the stepper to expose a plurality of stepping exposing patterns on an initial layer of a wafer in a step-and-repeat manner. Each subsequent stepping exposing pattern has at least one align mark overlaying with one of the align marks of a previous/adjacent stepping exposing pattern. A triangle geometric equation may be used to calculate the deviation angle resulting from stepping direction and reticle position (e.g., reticle skew angle) so that overlay accuracy against the initial layer may be monitored effectively for enhancing wafer production yield.

REFERENCES:
patent: 5601957 (1997-02-01), Mizutani et al.
patent: 5715063 (1998-02-01), Ota
patent: 5894350 (1999-04-01), Hsieh et al.
patent: 6011611 (2000-01-01), Nomura et al.

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