Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2002-11-18
2004-12-28
Paik, Sang Y. (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S544000
Reexamination Certificate
active
06835917
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a molding heater and a fabrication method thereof, and more particularly, to a molding heater for heating a semiconductor wafer and a fabrication method thereof.
2. Description of the Related Art
In processes of manufacturing a semiconductor device, such as chemical vapor deposition (CVD), sputtering, plasma etching and the like, heating of the semiconductor wafer is essential. The heating of the semiconductor wafer can be implemented by mounting a hot wire within a supporting plate on which the semiconductor wafer is placed.
FIGS. 1 and 2
are schematic views of a conventional heater. Referring to
FIGS. 1 and 2
, the conventional heater includes a first metal plate
10
a
, a second metal plate
10
b
and a heater wire
20
. The heater wire
20
also includes a hot wire
20
a
, an insulator (MgO)
20
b
surrounding the hot wire
20
a
, and a metal tube
20
c
surrounding the insulator (MgO)
20
b
. The heater wire
20
is mounted within a groove that is elongatedly formed on a contact surface of the metal plates
10
a
and
10
b
. A filler
30
is interposed between the heater wire
20
and the metal plates
10
a
and
10
b
in order to increase an adhesion efficiency.
If the hot wire
20
a
is directly contacted with the metal plates
10
a
and
10
b
, the hot wire
20
a
becomes electrically shorted to the metal plates
10
a
and
10
b
. Therefore, in order to prevent this phenomenon, the hot wire
20
a
is disposed on the middle of an inner space of the metal tube
20
c
and a space between the metal tube
20
c
and the hot wire
20
a
is filled with the insulator (MgO)
20
b
. Since the insulator (MgO)
20
b
is in a powdered form, if there is not the metal tube
20
c
, the insulator (MgO)
20
b
is fragile. The first metal plate
10
a
and the second metal plate
10
b
are joined together using a welding process or a blazing process.
In the above-described conventional heater, since the hot wire
20
a
is surrounded with a dual layer consisting of the insulator (MgO)
20
b
and the metal tube
20
c
, a large amount of power is consumed to transfer a heat generated at the hot wire
20
a
to the metal plates
10
a
and
10
b
. Accordingly, the hot wire
20
a
is easy to break due to an overheat of the hot wire
20
a
. Heat conduction is hindered at both the insulator (MgO)
20
b
itself and the contact surface between the metal tube
20
c
and the metal plates
10
a
and
10
b.
The insulator (MgO)
20
b
contains moisture while being filled. To this end, in case where the heat is generated at the hot wire
20
a
, a corresponding portion is expanded, so that a burst of the metal tube
20
c
may occur. Therefore, in order to discharge the moisture and gas generated inside the metal tube
20
c
to an outside of the metal tube
20
c
, it is necessary to perform an outgassing process for a long time.
If the blazing process is used as a coupling method of the metal plates
10
a
and
10
b
, a contamination may be caused during the process due to a reaction of material used in the blazing process, and the blazing material may be etched during an in-situ cleaning process. Further, in case of the welding process, since a welding surface is formed on lateral sides of the metal plates
10
a
and
10
b
, a deformation may be caused due to a heat stress of the metal plates
10
a
and
10
b
when a temperature rises or falls.
SUMMARY OF THE INVENTION
Therefore, the present invention has been devised to solve the above problems, and it is an object of the present invention to provide a molding heater capable of minimizing a heat resistance layer that disturbs a heat conduction, thereby improving a generation of heat, preventing a short of a hot wire caused by an overload, in which it is unnecessary to perform an outgassing process.
It is another object of the invention to provide a fabrication method of a molding heater.
To achieve the aforementioned object of the present invention, there is provided a molding heater comprising: a first metal plate having a recess formed at one side and a flat surface formed at the other side, wherein a groove is formed at a lower portion of the recess and a wafer is placed on the flat surface formed on one side thereof and a groove elongatedly formed on a lower portion of the recess; a hot wire inserted into the groove; a ceramic filled in a gap between the hot wire and the groove; and a second metal plate coupled with the first metal plate, the second metal plate filling the recess while closely contacting with the lower portion and lateral sides of the recess.
To achieve the another object of the invention, there is provided a method for fabricating a molding heater, comprising the steps of: a) providing a first metal plate having a recess formed at one side and a flat surface formed at the other side, wherein a groove is formed at a lower portion of the recess and a wafer is placed on the flat surface; b) inserting a hot wire into the groove; c) filling a gap between the hot wire and the groove with a ceramic; and d) coupling a second metal plate with the first metal plate, the second metal plate filling the recess while the second metal plate closely contacts with the lower portion and lateral sides of the recess.
REFERENCES:
patent: 2152126 (1939-03-01), Young
patent: 4304544 (1981-12-01), Crandell
patent: 5198641 (1993-03-01), Nagano et al.
patent: 5796074 (1998-08-01), Edelstein et al.
patent: 6180931 (2001-01-01), Futakuchiya et al.
patent: 6204486 (2001-03-01), Masaki et al.
patent: 6207932 (2001-03-01), Yoo
Jusung Engineering Co. Ltd.
Oliff & Berridg,e PLC
Paik Sang Y.
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