Molding for holding heat sinks in a clamped stack

Details Molding for holding heat sinks in a clamped stack Molding for holding heat sinks in a clamped stack

1999-07-01

2000-10-31

Potter, Roy

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257723, H01L 2334

Patent

active

061406996

ABSTRACT:
In a semiconductor clamped stack, in particular for high-power converters, a plurality of power semiconductor components are arranged alternately together with water-cooled cooling cans in a stack. A clear arrangement of all the components and supplies is achieved, and defective semiconductor components can be replaced more easily, in that a molding (10) according to the invention is used for holding in each case one heat sink and one power semiconductor component. Rails and latching-in fasteners are provided for guiding and holding the latter.

REFERENCES:
patent: 4029141 (1977-06-01), Ferrari et al.
"Serienschaltung von GTO-Thyristoren fur Frequenzumrichter hoher Leistung", Steimer, et al., ABB Technik, May 1996, pp. 14-20.

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