Molded semiconductor device with heat conducting members

Details Molded semiconductor device with heat conducting members Molded semiconductor device with heat conducting members

2007-07-24

2007-07-24

Lewis, Monica (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

C257S666000, C257S712000, C257S796000

Reexamination Certificate

active

10808567

ABSTRACT:
A power element package includes a semiconductor chip, radiating members, a mold resin member, a lead terminal for control signals, and lead terminals for large electric current. On a heat accepting surface of the radiating member, an insulating layer and a conductive layer are disposed. The lead terminal for control signals is electrically connected with a gate of the semiconductor chip through the conductive layer. An emitter of the semiconductor chip is electrically connected through a solder connection member with a non-insulating portion of the heat accepting surface.

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patent: 6845012 (2005-01-01), Ohkouchi
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patent: 2005/0040515 (2005-02-01), Inoue et al.
patent: 2006/0120047 (2006-06-01), Inoue
patent: A-08-078599 (1996-03-01), None
patent: A-10-79453 (1998-03-01), None
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patent: A-2002-164485 (2002-06-01), None
Meriam-Webster Online Dictionary, www.m-w.com.
First Office Action from Chinese Patent Office issued on Jul. 7, 2006 for the corresponding Chinese patent application No. 200410031258.4 (a copy and English translation thereof).

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