Molded resin casing of electronic part incorporating flexible bo

Details Molded resin casing of electronic part incorporating flexible bo Molded resin casing of electronic part incorporating flexible bo

1988-09-13

1990-12-18

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Making hole or aperture in article

26427218, B29C 4514

Patent

active

049784919

ABSTRACT:
Disclosed is a molded resin casing of a rotary- or sliding-type electronic part internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part, wherein a flexible board having the electric conductor patterns formed on a film comprising a synthetic resin material is used as the board, and the flexible board is inserted inside the synthetic resin casing in such a manner that the electric conductor patterns are exposed to the interior of the casing.

REFERENCES:
patent: 3444618 (1969-05-01), Sorlie
patent: 3809733 (1974-05-01), Sandiford
patent: 4429297 (1984-01-01), Nakatsu
patent: 4477795 (1984-10-01), Henmi et al.
patent: 4479106 (1984-10-01), Shimizu et al.
patent: 4479107 (1984-10-01), Bleeke
patent: 4734672 (1988-03-01), Kawana et al.

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