Molded heat sink for integrated circuit package

Details Molded heat sink for integrated circuit package Molded heat sink for integrated circuit package

1991-02-05

1992-10-13

Hille, Rolf

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 70, 357 72, 361389, 361421, 174 163, 174 524, 165 803, H01L 2302, H01L 2348

Patent

active

051555794

ABSTRACT:
A molded heat sink for plastic packages constructed for housing semi-conductor devices. Heat is removed from the semiconductor device by direct heat transfer from the device through upstanding members integrally molded in the top of the plastic housing. The integrally molded heat dissipation members facilitate cooling of the semi-conductor die which is not available by normal dissipation by convection and radiation through a generally planar external surface of the package. The molded members permit effective heat dissipation without the thermal coefficient of expansion mismatch which may occur between conventional molded packages and heat sinks secured thereto.

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Berndlmaier et al., "Semiconductor Package with Improved Cooling", IBM Tech. Disclosure Bulletin, vol. 20, No. 9 2/78, pp. 3452-3453.

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