Mold lock on heat spreader

Details Mold lock on heat spreader Mold lock on heat spreader

2009-05-11

2011-10-18

Reames, Matthew (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257SE23080, C438S122000

Reexamination Certificate

active

08039955

ABSTRACT:
A mold lock and a method of forming the mold lock are provided. The mold lock is used in an encapsulated semiconductor device and includes a neck and a shaped head integral with the neck. The mold lock can be formed to project above a support component, such as a heat spreader, of the semiconductor device and the neck is formed from the support component. The shaped head is of a greater dimension than the neck and can present a “T” shape in side view or a “Y” shape in side view. A base portion of the neck is seated within the support component. A method is provided for forming the described mold lock.

REFERENCES:
patent: 5278446 (1994-01-01), Nagaraj et al.
patent: 5990554 (1999-11-01), Golubic et al.

Affiliated with

Also associated with

Rating

Mold lock on heat spreader does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mold lock on heat spreader, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold lock on heat spreader will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4267451