Plastic article or earthenware shaping or treating: apparatus – Shaping surface including means to release or remove product... – By movable ejector means entering mold cavity
Patent
1990-11-14
1991-12-24
Chiesa, Richard L.
Plastic article or earthenware shaping or treating: apparatus
Shaping surface including means to release or remove product...
By movable ejector means entering mold cavity
249 67, 425556, B29C 4542
Patent
active
050747797
ABSTRACT:
A mold for resin-sealing of a semiconductor device includes a molding board, a cavity retainer which is secured to the molding board forming a void facing the molding board, a plurality of cavity inserts, each of which is embedded in the cavity retainer so that the face thereof is exposed, each cavity insert having a cavity formed in the face, a plurality of ejecting pins arranged to travel freely and penetrating each cavity insert and the cavity retainer, one end of the ejecting pin protruding into the inside of the void of the cavity retainer, the other end of each ejecting pin protruding into the inside of the cavity of the cavity insert, an ejector plate to which one end of each ejecting pin is secured, the ejector plate being positioned in the void of the cavity retainer, and elastic pins which penetrate through the ejector plate to elastically support the cavity inserts on the molding board.
REFERENCES:
patent: 3645492 (1972-02-01), Edlis
patent: 4645446 (1987-02-01), Hehl
patent: 4687434 (1987-08-01), Beglinger
patent: 4874308 (1989-10-01), Atlas et al.
patent: 5009587 (1991-04-01), Corvaglia et al.
Tanaka Sueyoshi
Tsutsumi Yasutsugu
Chiesa Richard L.
Mitsubishi Denki & Kabushiki Kaisha
LandOfFree
Mold for resin-sealing a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Mold for resin-sealing a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold for resin-sealing a semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-40522