Mold apparatus

Static molds – Including means within surface to confine heat exchange medium

Reexamination Certificate

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Details

C425S143000, C425S144000, C425S547000, C425S552000

Reexamination Certificate

active

11142232

ABSTRACT:
A mold apparatus having at least a pair of molds formed with a cavity, at least one pipe accommodator formed in the molds, at least one heat pipe mounted in the pipe accommodator, a heat-cool source part connected to the heat pipe the heat and cool the heat pipe, and a controller to control the heat-cool source part to selectively heat and cool the heat pipe. Thus a mold apparatus to reduce a molding cycle and improve the quality of a molded product's appearance is provided.

REFERENCES:
patent: 4390485 (1983-06-01), Yang
patent: 4496131 (1985-01-01), Yang
patent: 4902454 (1990-02-01), Steinbichler et al.
patent: 5055025 (1991-10-01), Muller
patent: 5653907 (1997-08-01), Kendall et al.
patent: 6276656 (2001-08-01), Baresich
patent: 6447283 (2002-09-01), Gellert
patent: 05-337997 (1993-12-01), None
patent: 6-31786 (1994-02-01), None
patent: 2001-9836 (2001-01-01), None
patent: 20-254879 (2001-11-01), None
patent: 20-0279300 (2002-06-01), None
patent: 20-317466 (2003-06-01), None
patent: 20-318611 (2003-06-01), None
patent: 10-2003-0064484 (2003-08-01), None
International Search Report issued on Aug. 24, 2005, for PCT/KR2005/001514.

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