Moisture-curing polyamides

Details Moisture-curing polyamides Moisture-curing polyamides

1995-01-17

1996-05-21

Seidleck, James J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From carboxylic acid or derivative thereof

5283291, 528335, 528336, 5283393, 528340, 525431, 525432, C08G 6926, C08G 6948

Patent

active

055191096

ABSTRACT:
Moisture-curing polyamides containing reactive alkoxysilane groups and a process for their preparation are provided. The reactive alkoxysilane groups contain organic groups which are not reactive during the production process, the intended application or the curing process. These moisture-curing polyamides have low melt viscosities and are useful as sealing compounds, hotmelt adhesives and encapsulating materials.

REFERENCES:
patent: 4409373 (1983-10-01), Wiemers et al.
patent: 4647630 (1987-03-01), Schmid et al.
patent: 5055249 (1991-10-01), Schmid
Henkel Corporation Emery Group, Technical Bulletin 100F, Specifications and Characteristics of Emery Chemicals, p. 5, Table 10, "Dimer, Trimer and Polybasic Acids." Date Unknown.
Kirk-Othmer Concise Encyclopedia of Chemical Technology, A. Wiley--Interscience Publication, 1985; p. 361, "Dimer Acids", Edward C. Leonard.

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