Module with stacked semiconductor devices

Details Module with stacked semiconductor devices Module with stacked semiconductor devices

2011-06-28

2011-06-28

Arora, Ajay K (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S686000, C257SE25006, C438S109000

Reexamination Certificate

active

07969019

ABSTRACT:
Semiconductor device1includes: first wiring board5provided with a plurality of external terminals9on the under surface thereof; first semiconductor chip3with the under surface thereof mounted on the upper surface of first wiring board5; and second semiconductor chip10with the under surface thereof mounted on the upper surface of first semiconductor chip3. On the upper surface of first wiring board5, connecting pad6aand connecting pad6bare provided, while connecting pad6ais electrically connected with the under surface of first semiconductor chip3and connecting pad6bis arranged closely to an end portion of first semiconductor chip3. Connecting pad6aand connecting pad6bare electrically connected with external terminals9. Semiconductor device1further includes: connecting pad6cprovided as contacting or as being close to an upper end portion of second semiconductor chip10while being electrically connected with the upper surface of second semiconductor chip10, and wire12which electrically connects connecting pad6band connecting pad6c.

REFERENCES:
patent: 2003/0148598 (2003-08-01), Tu et al.
patent: 2004/0113253 (2004-06-01), Karnezos
patent: 2007/0075435 (2007-04-01), Suminoe et al.
patent: 2007/0241463 (2007-10-01), Yamaguchi et al.
patent: 9-260536 (1997-10-01), None
patent: 2001-085609 (2001-03-01), None

Affiliated with

Also associated with

Rating

Module with stacked semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Module with stacked semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Module with stacked semiconductor devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2706741