Module with a built-in semiconductor and method for...

Details Module with a built-in semiconductor and method for... Module with a built-in semiconductor and method for...

2006-11-28

2006-11-28

Potter, Roy Karl (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S774000

Reexamination Certificate

active

07141884

ABSTRACT:
In a module with a built-in semiconductor, higher densification is achieved by disposing inner vias close to a semiconductor device. A module which has a space (107) between a first wiring layer (102a) and a built-in semiconductor device (105). The module is obtained by: mounting the semiconductor device (105) on a first wiring layer (102a) of a wiring board (103) without using a sealing resin; stacking on the circuit board an electrically insulating substrate having a through bore (inner via) (104) filled with a conductive paste and an opening for receiving the semiconductor device, and a mold release carrier having a second wiring layer (102b) in the stated order; and heating and pressurizing so that the semiconductor device (105) is incorporated in a core layer (101) which is formed by curing the electrically insulating substrate.

REFERENCES:
patent: 6909054 (2005-06-01), Sakamoto et al.
patent: 1 111 674 (2001-06-01), None
patent: 1 289 281 (2003-03-01), None
patent: 2001-244638 (2001-09-01), None
patent: 2001-245186 (2001-09-01), None

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