Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-11-22
2005-11-22
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S700000, C257S750000, C257S758000, C257S723000, C257S724000, C257S778000, C257S774000, C257S775000
Reexamination Certificate
active
06967398
ABSTRACT:
A multi-layer module for packaging an electronic component comprises an uppermost electrically conductive layer for mounting the component, a plurality of electrically insulative layers, and a plurality of electrically conductive layers disposed between the insulative layers. The electrically conductive layers form staggered placements of at least three voltage and/or ground distribution layers close to the module surface without signal wiring layers in between, and signal distribution layers comprising signal conductors. Vias form conductive paths through the insulative layers and conductive layers; the corresponding signal, voltage and ground distribution layers are electrically connected with each other and with the uppermost layer.
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Frech Roland
Garben Bernd
Klink Erich
Oggioni Stefano
Anderson Jay H.
Clark Jasmine
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