Modular wafer polishing apparatus and method

Details Modular wafer polishing apparatus and method Modular wafer polishing apparatus and method

1997-11-05

1999-09-28

Scherbel, David A.

Abrading

Machine

Rotary tool

451296, 451288, 451287, 451303, B24B 500, B24B 2900

Patent

active

059577649

ABSTRACT:
A wafer polishing apparatus includes a module frame; a continuous belt rotatable with respect to the frame, the belt having at least one vertically-oriented belt transverse portion including a polishing pad assembly; and at least one pivotable wafer-holding head drive within the frame and having a distal end portion movable to a vertical first position parallel and juxtaposed to the belt transverse portion. The head drive includes a wafer carrier for holding a wafer on the distal end portion of the head drive, while a drive moves the distal end portion and a held wafer into a vertical polishing position abutting the belt transverse portion and pressure is applied to the held-wafer against the polishing pad assembly while the wafer-holding distal end portion is rotated and swept side-by-side. After polishing the drive is reversed and the head drive is pivoted away from the belt transverse portion to a horizontal or other orientation and the then polished wafer removed. Multiple modules may be placed end-to-end or side-by-side with a robot pathway therebetween to load unpolished wafers and to unload polished wafers to a buffing station, to a cassette or other processing station.

REFERENCES:
patent: 653531 (1900-07-01), Richmond et al.
patent: 1275447 (1918-08-01), Hodny et al.
patent: 1420751 (1922-06-01), Ricketts
patent: 2057290 (1936-10-01), Bradbury
patent: 3841028 (1974-10-01), Katzke
patent: 3888850 (1975-06-01), Elm
patent: 4450652 (1984-05-01), Walsh
patent: 4662116 (1987-05-01), Erani
patent: 4736475 (1988-04-01), Ekhoff
patent: 4974619 (1990-12-01), Yu
patent: 5012618 (1991-05-01), Price et al.
patent: 5016399 (1991-05-01), Vinson
patent: 5061144 (1991-10-01), Akimoto et al.
patent: 5241792 (1993-09-01), Naka et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5333413 (1994-08-01), Hashimoto
patent: 5361545 (1994-11-01), Nakamura
patent: 5442416 (1995-08-01), Takeyama et al.
patent: 5460478 (1995-10-01), Akimoto et al.
patent: 5498199 (1996-03-01), Karlsrud et al.
patent: 5514025 (1996-05-01), Hasegawa et al.
patent: 5547515 (1996-08-01), Kudo et al.
patent: 5618227 (1997-04-01), Tsutsumi et al.
patent: 5655954 (1997-08-01), Oishi et al.
patent: 5665954 (1997-09-01), Oishi et al.
patent: 5679055 (1997-10-01), Greene et al.
patent: 5700046 (1997-12-01), Van Doren et al.
patent: 5762391 (1998-06-01), Sumnitsch
patent: 5762536 (1998-06-01), Pant et al.
patent: 5800254 (1998-09-01), Motley et al.

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