Modular sputtering machine having batch processing and serial th

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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Details

20429803, 20429807, 20429809, 20429815, 20429818, 20429817, 20429819, 2042982, 20429823, 20429827, C23C 1434, C23C 1456

Patent

active

057050449

ABSTRACT:
A flexible, modular sputtering machine comprises a number of batch process stations which define a batch process path. At least one of the batch process stations is a sputtering station including a serial sputtering chamber and an interchamber disk transfer mechanism. The disks move in batches along the process path, being individually processed only at the sputtering chamber. A preferred sputtering source is also provided which allows selective sputtering of multiple materials within a single sputtering chamber. The selection of sputtering materials is controlled by varying the magnetic field within the sputtering chamber. A cassette for transporting and holding batches of disk substrates during batch processing allows individual access to the disks for the interchamber disk transfer mechanism.

REFERENCES:
patent: 4401539 (1983-08-01), Abe et al.
patent: 4569746 (1986-02-01), Hutchinson
patent: 4701251 (1987-10-01), Beardow
patent: 4756815 (1988-07-01), Turner et al.
patent: 4786564 (1988-11-01), Chen et al.
patent: 4810346 (1989-03-01), Wolf et al.
patent: 4869802 (1989-09-01), Wirz et al.
patent: 4911810 (1990-03-01), Lauro et al.
patent: 4971674 (1990-11-01), Hata
patent: 5033406 (1991-07-01), Lee
patent: 5106470 (1992-04-01), Takei et al.
patent: 5126027 (1992-06-01), Kudo et al.
patent: 5174875 (1992-12-01), Hurwitt et al.
patent: 5180478 (1993-01-01), Hughes
patent: 5215420 (1993-06-01), Hughes et al.
patent: 5228968 (1993-07-01), Zejda
patent: 5244554 (1993-09-01), Yamagata et al.
patent: 5262030 (1993-11-01), Potter
patent: 5316864 (1994-05-01), Hedgcoth
patent: 5512150 (1996-04-01), Bourez et al.
Abe et al. "Planar Magnetron Sputtering Cathode With Deposition Rate Distribution Controllability," Thin Solid Films, 96:225-233 (1982).

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