Modular semiconductor device

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor

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Details

357 74, 357 75, 357 81, 361384, 361396, 361397, 361400, 361404, 361412, H01L 3902, H01L 2302, H01L 2312, H01L 2316

Patent

active

050253077

ABSTRACT:
A modular semiconductor device includes a pair of generally parallel electronic circuit boards and a plurality of IC packages mounted between the electronic circuit boards. Two or more modular semiconductor devices may be stacked on each other so that memory capacity can be readily enlarged and the function level can be readily improved. A heating, radiating fin of planar or honeycomb structure may be provided in near contact with an IC package.

REFERENCES:
patent: 3246386 (1966-04-01), Ende
patent: 3535595 (1970-10-01), Moore
patent: 4790373 (1988-12-01), Raynor et al.
patent: 4827328 (1989-05-01), Ozawa et al.
patent: 4837663 (1989-06-01), Zushi et al.
patent: 4860163 (1989-09-01), Sarath

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