Modular power device assembly

Details Modular power device assembly Modular power device assembly

1990-02-14

1991-02-05

Hille, Rolf

357 70, 357 75, 357 80, H01L 2302, H01L 3902, H01L 2316, H01L 2944

Patent

active

049910027

ABSTRACT:
Very compact, low cost power semiconductor device modules suitable for use in variable speed motor controllers multiple solenoid drivers, and the like are provided by attaching pre-packaged (e.g., type TO-220) semiconductor devices by their heat dissipation surfaces to opposed planar faces of a metal heat conduction plate using an electrically insulating and thermally conductive epoxy. By proper choice of the heat conduction plate thickness and the device-to-device spacing thereon, the leads of the pre-packaged devices can be arranged to have, on the modules, the same lead-to-lead and row-to-row spacing as for common JEDEC DIL-IC packages so that the modules fit on a conventional package footprint when mounted on a circuit board.

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Schultz, `A Simple Brush Type DC Motor Controller`, Motorola Semiconductor Eng., Bulletin EB123 (1989).
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Gaven et al., Application Note-AN1046, (1989).
`Full Pak Power Semiconductors`, Motorola Brochure SG131/D.
`High Fidelity Switching`, Motorola Note AN1042, (1989).

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