Modular packaging arrangements and methods

Details Modular packaging arrangements and methods Modular packaging arrangements and methods

2005-05-03

2005-05-03

Reichard, Dean A. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C361S760000, C361S807000

Reexamination Certificate

active

06888064

ABSTRACT:
The present invention relates generally to chip packaging and methods of packaging and, more particularly, to compact packaging of chips and methods thereof in electronic environments that minimize undesired electronic effects, promote speed, and enhance packaging versatility.

REFERENCES:
patent: 4562092 (1985-12-01), Wiech, Jr.
patent: 4912401 (1990-03-01), Nady, II et al.
patent: 5460531 (1995-10-01), Vivio
patent: 5543584 (1996-08-01), Handford et al.
patent: 5557504 (1996-09-01), Siegel et al.
patent: 5909010 (1999-06-01), Inoue
patent: 5994774 (1999-11-01), Siegel et al.
patent: 6004867 (1999-12-01), Kim et al.
patent: 6303954 (2001-10-01), Ohoka
patent: 6354859 (2002-03-01), Barabi et al.
patent: 6614121 (2003-09-01), Heenan
patent: 20010035529 (2001-11-01), Bertin et al.
patent: 20020164893 (2002-11-01), Mathieu et al.
IBM Technical Disclosure Bulletin, vol. 33, No. 6B, Nov. 1990, pp. 473-474 “Non-Permanent Mounting Technique for Test and Burn-In of C4 Devices”.
Electronic Design, Dec. 7, 1999, vol. 47, No. 26, Advanced IC Packages, pp. 1-6 “Advanced IC Packages Keep Silicon and Systems Flying” by David Morrison.
url: http://216.239.51.100/search?q=cac.../298113.htm+chip+scale+packaging&hl=en&ie=UTF-8 “Chip Scale Packaging (CSP) for Intel Flash Memory Devices—Product Overview”.

Affiliated with

Also associated with

Rating

Modular packaging arrangements and methods does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Modular packaging arrangements and methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Modular packaging arrangements and methods will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3447624