Electrical computers and digital processing systems: memory – Storage accessing and control – Hierarchical memories
Reexamination Certificate
2006-02-07
2006-02-07
Verbrugge, Kevin (Department: 2189)
Electrical computers and digital processing systems: memory
Storage accessing and control
Hierarchical memories
C711S147000, C709S252000
Reexamination Certificate
active
06996681
ABSTRACT:
The present invention relates to a modular interconnection architecture for an expandable multiprocessor machine. It comprises a first interconnection level (MI) comprising connection agents (NCSi) that connect the multiprocessor modules and handle the transactions between the multiprocessor modules, and a second interconnection level (SI) comprising external connection nodes (NCEj) that connect the nodes (Nj) to one another and handle the transactions between the nodes (Nj). Each external connection node (NCEj) comprises two connection agents identical to the connection agent (NCSi), connected head-to-tail, one of the two agents (NCS′j) receives and filters the transactions sent by the node (Nj) to which it is connected. The other agent (NCS″j) receives and filters the transactions sent by the other nodes (Nj) to which it is connected. Its applications specifically include the construction of an entire range of machines: UMA, QUASI-UMA, NUMA, cluster, etc.
REFERENCES:
patent: 4491945 (1985-01-01), Turner
patent: 4952930 (1990-08-01), Franaszek et al.
patent: 5105424 (1992-04-01), Flaig et al.
patent: 5396596 (1995-03-01), Hashemi et al.
patent: 5734922 (1998-03-01), Hagersten et al.
patent: 5983326 (1999-11-01), Hagersten et al.
patent: 6041376 (2000-03-01), Gilbert et al.
patent: 0 603 801 (1994-06-01), None
patent: 0 817 076 (1998-01-01), None
Charlesworth, Alan, Starfire: Extending the SMP Envelope, Jan./Feb. 1998, IEEE, Micro, pp. 39-49.
Sihin-Ichito Mori: “A Distributed shared memory and cache architectures” Supercomputing 93, Nov. 15-19, 1993, pp. 740-749, XP000437411, Los Alamitos, entire document.
BULL S.A.
Kondracki Edward J.
Miles & Stockbridge P.C.
Verbrugge Kevin
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