Modular chassis divided along a midplane and cooling system...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C361S818000, C439S718000, C710S302000

Reexamination Certificate

active

10873374

ABSTRACT:
A chassis divides vertically, with front and rear sections of the chassis joined immediately adjacent a midplane printed circuit board that supports interconnectivity of electronic circuits. Wiring within the chassis is eliminated through directed connections of all components to the midplane. Minimal hardware is required for securing the front and rear sections together, and therefore accessing the midplane for assembly and service is convenient. All components except the midplane are installed and removed from either the front or rear of the chassis without opening or disassembling the chassis. The chassis layout and features facilitate effective cooling of the components in the chassis.

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patent: WO 00/58779 (2000-09-01), None

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