Modular bonding pad structure and method

Details Modular bonding pad structure and method Modular bonding pad structure and method

2007-09-25

2007-09-25

Fourson, George R. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S692000, C257S698000, C257SE23020, C257SE23070, C257SE23152

Reexamination Certificate

active

11234003

ABSTRACT:
A semiconductor die includes a plurality of drivers and a plurality of bonding pads. Each driver is formed by a plurality of interconnected modules and has an associated bonding pad to which at least one of the modules of the driver is electrically connected. The modules of some of the drivers are positioned outside of the associated bonding pad toward a periphery of the die. The bonding pads may be arranged, for example, in a double- or triple-staggered pattern around the periphery of the die.

REFERENCES:
patent: 6489688 (2002-12-01), Baumann et al.

Affiliated with

Also associated with

Rating

Modular bonding pad structure and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Modular bonding pad structure and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Modular bonding pad structure and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3773667