Modifying a semiconductor device to provide electrical...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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C257S690000, C257S734000, C257S735000, C257S698000, C257S786000, C257SE23015, C257SE23079

Reexamination Certificate

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11154872

ABSTRACT:
A method of modifying a semiconductor device to provide electrical parameter monitoring. The device includes a semiconductor die and a package substrate. The substrate includes a conductive plane. The die is connected to the plane via a plurality of connection structures. The method includes disconnecting a first one of the connection structures from the plane, and connecting the first connection structure to an external package connection, thereby providing a capability to monitor an electrical parameter of the die via the external package connection.

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National Semiconductor article, entitled “National Semiconductor LVDS Products - National's Innovative LVDS Solutions for Backplane & Cable Interconnect”; pp. 1-8; Oct. 2001.

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