Modeling a sample with an underlying complicated structure

Optics: measuring and testing – Dimension – Thickness

Reexamination Certificate

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C356S237200, C356S237100

Reexamination Certificate

active

10859330

ABSTRACT:
A model of a sample with one or more films that overlie a complicated structure can be produced using a first portion that models the physical characteristics of the film(s) and a second portion that does not attempt to model the physical characteristics of the underlying structure, but instead models the affect of the underlying structure on incident light. By way of example, the second portion of the model may use a one-dimensional periodic pattern to model a complicated two-dimensional periodic pattern. A characteristic, such as thickness, of the film(s) may be measured using the model. The results may be verified by the linear relationship of ratios between a plurality of measured locations on the sample and associated locations on the sample that do not have the underlying structures.

REFERENCES:
patent: 5963329 (1999-10-01), Conrad et al.
patent: 6483580 (2002-11-01), Xu et al.
patent: 6485872 (2002-11-01), Rosenthal et al.
patent: 6654108 (2003-11-01), Ravid et al.
patent: 6720568 (2004-04-01), Finarov et al.
patent: 6940592 (2005-09-01), Borden et al.
patent: 2003/0210408 (2003-11-01), Jun et al.
patent: 2004/0080761 (2004-04-01), Du-Nour et al.

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