Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2007-11-20
2007-11-20
Garbowski, Leigh M. (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000
Reexamination Certificate
active
10773541
ABSTRACT:
The present invention includes a method for detecting model stamping errors during circuit simulation without the need for golden data. The method checks for model stamping errors by determining whether entries in model stamping matrices interrelate according to a plurality of preset rules before circuit equations are solved.
REFERENCES:
patent: 5084824 (1992-01-01), Lam et al.
patent: 5313398 (1994-05-01), Rohrer et al.
patent: 5588142 (1996-12-01), Sharrit
patent: 6334100 (2001-12-01), Ahrikencheikh et al.
patent: 2004/0049370 (2004-03-01), Stanley et al.
Achar, R. et al., (May 2001). “Simulation of High-Speed Interconnects,”Proceeding of the IEEE89(5):693-728.
Bomhof, C. W. (2001). “Introduction,” Chapter 1In Interative and Parallel Methods for Linear Systems, With Applications in Circuit Simulation, located at <http://www.library.uu.nl/digiarchief/dip/diss/1957853/c1.pdf>, last visited on Jun. 15, 2004, 15 pages (Includes Table of Contents).
Devgan, A. (1995) “Efficient and Accurate Transient Simulation in Charge-Voltage Plane,” International Conference on Computer Aided Design (ICCAD '95) Proceedings of the 1995 IEEE/ACM international conference on Computer-aided design, San Jose, California, United States, pp. 110-114.
Nguyen, T. V. et al., (1998). “Simulation of Coupling Capacitances Using Matrix Partitioning,” International Conference on Computer Aided Design (ICCAD '98), Proceedings of the 1998 IEEE/ACM imternational conference on Computer-aided design, San Jose, California, United States pp. 12-18.
Schwarz, D. E. et al., (2000). “Structural Analysis For Electric Circuits and Consequences for MNA,”Int. J. Circ. Theor. Appl. 28:131-162.
Krummenacher, F. et al., (Jul. 28, 2000). “RF EKV MOSFET Model Implementation,” EPFL—Electronics Laboratories (LEG), EPF-Lausanne, Switzerland, Craft European Project No. 25710, Jul. 28, 2000, WP2, Deliverable D2.1, Ecole Polytechnique Federale de Lausanne 4 pages.
Zhou, X. (2000). “Multi-Level Modeling of Deep-Submicron Mosfets and ULSI Circuits,”9th International Conference on Mixed Design of Integrated Circuits and Systems, Mixdes 2002, Wroclaw, Poland, Jun. 20-22, 2002, 7 pages.
Wroclaw, Poland, Jun. 20-22, 2002, 7 pages.
Liu Zhihong
Ma Yutao
McGaughy Bruce
Cadence Design Systems, Inc
Garbowski Leigh M.
Morrison & Foerster / LLP
LandOfFree
Model stamping matrix check technique in circuit simulator does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Model stamping matrix check technique in circuit simulator, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Model stamping matrix check technique in circuit simulator will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3873088