Moat for die pad cavity in bond station heater block

Details Moat for die pad cavity in bond station heater block Moat for die pad cavity in bond station heater block

1995-03-31

1996-09-24

Heinrich, Samuel M.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 447, H01L 2160, B23K 3704

Patent

active

055582672

ABSTRACT:
A wire bond station has a platform (32) in cavity (31) of the work station heater block (30) on which a lead frame die mount pad (33) is placed during wire bonding to semiconductor chip mounted on the die mount pad. The platform (32) is of a dimension such that the edges of the die mount pad (33) extend out from the platform (32) so that irregularities (34) on the edges of the die mount pad (33) do not support the die mount pad (33) above the platform (32).

REFERENCES:
patent: 3995845 (1976-12-01), Scheffer
patent: 5201450 (1993-04-01), Ahn
patent: 5249726 (1993-10-01), Sato

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