MMIC module using flip-chip mounting

Details MMIC module using flip-chip mounting MMIC module using flip-chip mounting

1998-03-05

2000-10-10

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257684, H01L 2348

Patent

active

061304832

ABSTRACT:
A semiconductor module has an MMIC chip flip-chip-mounted on a board. The MMIC chip has a ground line and bumps. The board has through holes and a ground electrode. These ground line, bumps, through holes, and ground electrode form a conductor continuum that defines a quasi-cavity. The module is designed so that the resonance frequency (fr) of the quasi-cavity is higher than the maximum operation frequency (fumax) of the MMIC chip. This prevents signal disturbance due to agreement between the resonance frequency (fr) and an operation frequency (fu) of the MMIC chip. If the MMIC chip is provided with bias circuits having MIM capacitors, the MIM capacitors are formed within the quasi-cavity. The quasi-cavity blocks magnetic fields generated by the MIM capacitors from leaking outside and badly affecting electronic parts arranged around the MMIC chip. The thickness of the MMIC chip is limited within a given range, to prevent coupling between a parasitic transmission line made of the substrate and ground line of the MMIC chip and a main transmission line on the MMIC chip, to thereby secure isolation between input and output signals to and from the MMIC chip.

REFERENCES:
patent: 5045820 (1991-09-01), Leicht et al.
patent: 5428327 (1995-06-01), Bahl
patent: 5602421 (1997-02-01), Li
patent: 5635767 (1997-06-01), Wenzel et al.
patent: 5659203 (1997-08-01), Call et al.
patent: 5757074 (1998-05-01), Matloubian et al.
Leah M. Felton, "High-Yield GaAs Flip-Chip MMICs Lead to Low Cost T/R Modules," 1994 IEEE MTT-S Digest, pp. 1707-1710.
Satoshi Yamaguchi, et al., "An Inverted Microstrip Line IC Structure for Ultra High-Speed Applications", Intenational Microwave Symposium TH4E-7, IEEE MTT-S Digest, Jun. 1995, pp. 1643-1646.
G. Baumann, et al., "Comparison of Flip Chip and Wire Bond Interconnections and the Technology Evaluation on 51 GHz Transceiver", Proceedings 26.sup.th European Microwave Conference, Sep. 1996, pp. 98-100.
T. Krem et al., "Advantages of Flip Chip Technology in Millimeter Wave Packing," IEEE MTT-S International Microwave Symposium Digest, vol. 1, Jun. 8, 1997, pp. 987-990.
S. Aoki et al., "A Flip Chip Bonding Technology Used Gold Pillars for Millimeter-Wave Applications," 1997 IEEE MTT-S nternational Microwave Symposium Digest, vol. 1, Jun. 8, 1997, pp. 731-734.
R. Jackson et al., "Modeling Millimeter-Wave IC Behavior for Flipped-Chip Mounting Schemes," IEEE Transactions on Microwave Theory and Techniques, vol. 45, No. 10, Oct. 1997, pp. 1919-1925.

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