Mixed excitation plasma etching system

Details Mixed excitation plasma etching system Mixed excitation plasma etching system

1984-10-29

1986-04-08

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156646, 204192E, 204298, B44C 122, C03C 1500, C03C 2506

Patent

active

045811008

ABSTRACT:
It has been discovered surprisingly that when a plasma is produced by exciting a gas or mixture of gases with microwaves and simultaneously also with a radio frequency electrical discharge, that the resulting plasma is much more highly chemically reactive than a plasma produced instead by only one of the excitations. Such a plasma etches a surface much faster than the sum of the etch rates produced by each of the excitations individually and the etching anisotropy may be controlled by varying the ratio of the applied power of each of the two kinds of simultaneous excitation.

REFERENCES:
patent: 4298419 (1981-11-01), Suzuki et al.
patent: 4316791 (1982-02-01), Taillet
patent: 4384933 (1983-05-01), Takasaki

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