Mitigation of high stress areas in vertically offset structures

Details Mitigation of high stress areas in vertically offset structures Mitigation of high stress areas in vertically offset structures

2009-02-06

2011-11-08

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C257SE21295, C438S050000

Reexamination Certificate

active

08053265

ABSTRACT:
Alternative methods of constructing a vertically offset structure are disclosed. An embodiment includes forming a flexible layer having first and second end portions, an intermediate portion coupling the first and second portions, and upper and lower surfaces. The distance between the upper and lower surfaces at the intermediate portion is less than the distance between the upper and lower surfaces at the first and second end portions. The first end portion is bonded to a base member. The second end portion of the flexible layer is deflected until the second end portion contacts the base member. The second end portion is bonded to the base member.

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