Misted deposition method with applied UV radiation

Details Misted deposition method with applied UV radiation Misted deposition method with applied UV radiation

1996-01-25

1999-10-12

Nuzzolillo, Maria

Coating processes

Direct application of electrical, magnetic, wave, or...

Chemical vapor deposition

4272481, 4272552, 427421, 427585, C23C 800

Patent

active

059652195

ABSTRACT:
UV radiation is applied to a substrate in a deposition chamber to desorb water and other contaminates from it. A liquid precursor is misted, flowed into the deposition chamber and deposited on a substrate while UV radiation is applied to the mist. The film of liquid on the substrate is dried and annealed on the substrate while the UV radiation is applied to form a solid thin film of a metal oxide. The thin film is then incorporated into an electronic device of an integrated circuit fabricated on the substrate. The application of UV radiation to both the mist during deposition and the thin film after deposition significantly increases the quality of the resulting integrated circuits. The process has been found to be particularly excellent for making BST, strontium bismuth tantalate, and strontium bismuth niobate.

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Yamada, A., et al., "Photochemical Vapor Deposition of Si/Si.sub.1-x Ge.sub.x Strained layer Superlattices at 250.degree. C.," Jpn. J. Appl. Phys., vol. 27, No. 11, pp. L2174-L2176 (Nov. 1988).

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