Misted deposition method of fabricating integrated circuits

Details Misted deposition method of fabricating integrated circuits Misted deposition method of fabricating integrated circuits

1995-01-23

1999-03-30

Talbot, Brian K

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427226, 4271263, 4272553, 427124, B05D 512, C23C 1600

Patent

active

058885838

ABSTRACT:
A method and apparatus are disclosed for forming thin films of chemical compounds utilized in integrated circuits. The method includes steps forming a precursor liquid comprising a chemical compound in a solvent, providing a substrate within a vacuum deposition chamber, producing a mist of the precursor liquid, and flowing the mist into the deposition chamber while maintaining the chamber at ambient temperature to deposit a layer of the precursor liquid on the substrate. The liquid is dried to form a thin film of a solid material on the substrate, then the integrated circuit is completed to include at least a portion of the film of solid material in a component of the integrated circuit.

REFERENCES:
patent: 4571350 (1986-02-01), Parker et al.
patent: 4595609 (1986-06-01), Wellingthoff et al.
patent: 4725344 (1988-02-01), Yocom et al.
patent: 4993361 (1991-02-01), Unvala
patent: 5393564 (1995-02-01), Westmoreland et al.
Metalorganic Deposition (MOD) A Nonvacuum, SPin-on, Liquid-Based, Thin Film Method, Oct. 1989.

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