Misted deposition apparatus for fabricating an integrated circui

Details Misted deposition apparatus for fabricating an integrated circui Misted deposition apparatus for fabricating an integrated circui

1994-10-11

1996-07-30

Collins, Laura

Coating apparatus

With vacuum or fluid pressure chamber

118 501, 118 52, 118319, 118320, 118326, 118629, 118638, C23C 1400

Patent

active

055407722

ABSTRACT:
A method and apparatus are disclosed for forming thin films of chemical compounds utilized in integrated circuits. The method includes steps of forming a precursor liquid comprising a chemical compound in a solvent, providing a substrate within a vacuum deposition chamber, producing a mist of the precursor liquid, and flowing the mist into the deposition chamber while maintaining the chamber at ambient temperature to deposit a layer of the precursor liquid on the substrate. The liquid is dried to form a thin film of a solid material on the substrate, then the integrated circuit is completed to include at least a portion of the film of solid material in a component of the integrated circuit.

REFERENCES:
patent: 3880112 (1975-04-01), Spitz et al.
patent: 3976031 (1976-08-01), Itoh
patent: 4075974 (1978-02-01), Plows et al.
patent: 4290384 (1981-09-01), Ausschnitt et al.
patent: 4647338 (1987-03-01), Visser
patent: 4689247 (1987-08-01), Doty et al.

Affiliated with

Also associated with

Rating

Misted deposition apparatus for fabricating an integrated circui does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Misted deposition apparatus for fabricating an integrated circui, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Misted deposition apparatus for fabricating an integrated circui will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1655290