Mirror structure with single crystal silicon cross-member

Details Mirror structure with single crystal silicon cross-member Mirror structure with single crystal silicon cross-member

2008-05-06

2008-05-06

Sugarman, Scott J. (Department: 2873)

Optical: systems and elements

Optical modulator

Light wave temporal modulation

C359S292000

Reexamination Certificate

active

11299140

ABSTRACT:
Hydrogen cleave silicon process for light modulating mirror structure using single crystal silicon as the base cross-member. Existing processes use two critical alignment steps that can contribute to higher actuation voltages and result in lower manufacturing yields. The hydrogen cleave process simplifies the manufacturing process to one step: transferring a thin film of single crystal silicon to the CMOS substrate, resulting in minimal alignment error and providing large bonding area.

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