Miniaturized wide-band baluns for RF applications

Details Miniaturized wide-band baluns for RF applications Miniaturized wide-band baluns for RF applications

2007-06-08

2009-12-08

Lee, Benny (Department: 2817)

Wave transmission lines and networks

Coupling networks

Balanced to unbalanced circuits

Reexamination Certificate

active

07629860

ABSTRACT:
A wide-band balun device includes a first metallization deposited over a substrate and oriented in a first coil. The first coil extends horizontally across the substrate while maintaining a substantially flat vertical profile. A second metallization is deposited over the substrate and oriented in a second coil. The second coil is magnetically coupled to the first coil and a portion of the second coil oriented interiorly of the first coil. A third metallization is deposited over the substrate and oriented in a third coil. The third coil is magnetically coupled to the first and second coils. A first portion of the third coil is oriented interiorly of the second coil. The third coil has a balanced port connected to the third coil between secondhand third portions of the third coil.

REFERENCES:
patent: 5697088 (1997-12-01), Gu
patent: 6515556 (2003-02-01), Kato et al.
patent: 6683510 (2004-01-01), Padilla
patent: 7042303 (2006-05-01), Anthony et al.
patent: 7397328 (2008-07-01), Yasuda et al.
Chen et al., “Novel Broadband Planar Balun Using Multiple Coupled Lines,” Information and Communications Research Laboratories, Industrial Technology Research Institute, Hsinchu 310, Taiwan, IEEE IMS Digest, pp. 1571-1574, Jun. 2006.

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