Wave transmission lines and networks – Coupling networks – Delay lines including long line elements
Reexamination Certificate
2007-07-03
2007-07-03
Pascal, Robert (Department: 2817)
Wave transmission lines and networks
Coupling networks
Delay lines including long line elements
C333S243000, C333S160000
Reexamination Certificate
active
10607931
ABSTRACT:
RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
REFERENCES:
patent: 2976534 (1961-03-01), Kampinsky
patent: 3160826 (1964-12-01), Marcatili
patent: 3729740 (1973-04-01), Nakahara et al.
patent: 3963999 (1976-06-01), Nakajima et al.
patent: 4021789 (1977-05-01), Furman et al.
patent: 4127831 (1978-11-01), Riblet
patent: 4647878 (1987-03-01), Landis et al.
patent: 4673904 (1987-06-01), Landis
patent: 4776087 (1988-10-01), Cronin et al.
patent: 4816618 (1989-03-01), Bongianni
patent: 4958222 (1990-09-01), Takakura et al.
patent: 5190637 (1993-03-01), Guckel
patent: 5426399 (1995-06-01), Matsubayashi et al.
patent: 5455545 (1995-10-01), Garcia
patent: 5652557 (1997-07-01), Ishikawa
patent: 6008102 (1999-12-01), Alford et al.
patent: 6027630 (2000-02-01), Cohen
patent: 6417742 (2002-07-01), Enokuma
patent: 6480163 (2002-11-01), Knop et al.
patent: 6523252 (2003-02-01), Lipponen
patent: 6572742 (2003-06-01), Cohen
patent: 6724277 (2004-04-01), Holden et al.
patent: 2003/0127336 (2003-07-01), Cohen et al.
patent: 2003/0221968 (2003-12-01), Cohen et al.
patent: 2003/0222738 (2003-12-01), Brown et al.
patent: 2003/0234179 (2003-12-01), Bang
patent: 2004/0000489 (2004-01-01), Zhang et al.
patent: 2004/0004001 (2004-01-01), Cohen et al.
patent: 2004/0004002 (2004-01-01), Thompson et al.
patent: 2004/0007468 (2004-01-01), Cohen et al.
patent: 2004/0020782 (2004-02-01), Cohen et al.
patent: 2004/0065550 (2004-04-01), Zhang
patent: 2004/0065555 (2004-04-01), Zhang
patent: 2004/0263290 (2004-12-01), Sherrer et al.
patent: 0313058 (1989-04-01), None
patent: 1-125956 (1989-05-01), None
patent: 6-232217 (1994-08-01), None
patent: 8-274167 (1996-10-01), None
patent: 2046469 (1995-10-01), None
patent: WO 00/39854 (2000-07-01), None
patent: WO 03/049514 (2003-06-01), None
Cohen, et al., “EFAB: Batch Production of Functional, Fully-Dense Metal Parts with Micron-Scale Features”, Proc. 9th Solid Freeform Fabrication, The University of Texas at Austin, Aug. 1998, p. 161.
Adam L. Cohen, et al., “EFAB: Rapid, Low-Cost Desktop Micromachining of High Aspect Ratio True 3-D MEMS”, Proc. 12th IEEE Micro Electro Mechanical Systems Workshop, IEEE, Jan. 1999, p. 244.
“Microfabrication—Rapid Prototyping's Killer Application”, Rapid Prototyping Report, CAD/CAM Publishing, Inc., Jun. 1999, pp. 1-5.
Adam L. Cohen, “3-D Micromachining by Electrochemical Fabrication”, Micromachine Devices, Mar. 1999, pp. 6-7.
Gang Zhang, et al., “EFAB: Rapid Desktop Manufacturing of True 3-D Microstructures”, Proc. 2nd International Conference on Integrated MicroNanotechnology for Space Applications, The Aerospace Co., Apr. 1999.
F. Tseng, et al., “EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructures Using a Low-Cost Automated Batch Process”, 3rd International Workshop on High Aspect Ratio Microstructure Technology (HARMST'99), Jun. 1999.
Adam L. Cohen, et al., “EFAB: Low-Cost, Automated Electrochemical Batch Fabrication of Arbitrary 3-D Microstructures”, Micromachining and Microfabrication Process Technology, SPIE 1999 Symposium on Micromachining and Microfabrication, Sep. 1999.
F. Tseng, et al., “EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructures Using a Low-Cost Automated Batch Process”, MEMS Symposium, ASME 1999 International Mechanical Engineering Congress and Exposition, Nov. 1999.
Adam L. Cohen, “Electrochemical Fabrication (EFABTM)”, Chapter 19 of the MEMS Handbook, edited by Mohamed Gad-El-Hak, CRC Press, 2002, pp. 19/1-19/23.
J. A. Bishop, et al., “Monolithic Coaxial Transmission Lines for mm-wave ICs”, High Speed Semiconductor Devices and Circuits, 1991., Proceeding IEEE/Cornell Conference on Advanced Concepts in Ithaca, NY, USA Aug. 5-7, 1991, pp. 252-260.
Jeong Inho, et al., “Monolithic Implementation of Air-Filled Rectangular Coaxial Line”, Electronics Letters, IEE Stevenage, GB, vol. 36, No. 3, Feb. 3, 2000, pp. 228-230.
Bang Christopher A.
Brown Elliott R.
Cohen Adam L.
Evans John D.
Grosser Morton
Glenn Kimberly E
Microfabrica Inc.
Pascal Robert
Smalley Dennis R.
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