Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-03-10
1993-09-28
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156654, 156664, 252 792, 252 793, B44C 122, C23F 100, C09K 1308
Patent
active
052483860
ABSTRACT:
A substantially nitrate-free solution for milling products of refractory metals, especially titanium, which milling solution comprises: (a) about 20-100 g/l hydrofluoric acid; (b) a hydrogen inhibitor selected from the group comprising of: about 55-650 g/l of sodium chlorate, about 180-650 g/l of ammonium peroxysulfate, and at least about 10 g/l of hydrogen peroxide; and (c) a balance of water and impurities. A method for chemically milling, etching and/or pickling metal products, such as titanium alloy forgings, with the aforementioned solution is also disclosed.
REFERENCES:
patent: 2739047 (1956-03-01), Sanz
patent: 2974021 (1961-03-01), Borowik
patent: 2981610 (1961-04-01), Snyder et al.
patent: 3666580 (1972-05-01), Kreml et al.
patent: 3788914 (1974-01-01), Gumbelevicius
patent: 3844859 (1974-10-01), Roni
patent: 3905883 (1975-09-01), Hanazono et al.
patent: 3905907 (1975-09-01), Shiga
patent: 3936332 (1976-02-01), Matsumoto et al.
patent: 3939089 (1976-02-01), Matsumoto et al.
patent: 3944496 (1976-03-01), Coggins et al.
patent: 3954498 (1976-05-01), Flowers
patent: 4116755 (1978-09-01), Coggins et al.
patent: 4130454 (1978-12-01), Dutkewych et al.
patent: 4220706 (1980-09-01), Spak
patent: 4314876 (1982-02-01), Kremer et al.
patent: 4337114 (1982-06-01), Russell et al.
patent: 4725374 (1988-02-01), Pryor et al.
patent: 4787958 (1988-11-01), Lytle
patent: 4900398 (1990-02-01), Chen
patent: 4973380 (1990-11-01), Pryor et al.
patent: 5074955 (1991-12-01), Henry et al.
Dastolfo, Jr. LeRoy E.
Davis Mark E.
Tarcy Gary P.
Wehrle William P.
Aluminum Company of America
Powell William A.
Topolosky Gary P.
LandOfFree
Milling solution and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Milling solution and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Milling solution and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2188796