Millimeter wave ceramic package

Details Millimeter wave ceramic package Millimeter wave ceramic package

1994-03-18

1995-09-19

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For high frequency device

257701, 257702, 257703, 257704, 257706, 257709, 333247, H01L 2302, H01L 2312

Patent

active

054518180

ABSTRACT:
An improved millimeter wave device package design in which the package includes a dielectric substrate disposed upon a supporting base such that the substrate extends substantially along the peripheral edge of the base, defining a central aperture. A solid conductive layer substantially covers the first surface of the dielectric substrate and a series of conductive transmission lines are formed on an opposing second surface of the substrate. A dielectric layer is disposed upon and substantially covers the transmission lines and the second surface of the substrate upon which they are formed. A seal ring is disposed upon and the dielectric layer and a conductor electrically connects the device to the transmission lines. A lid is sealed atop the seal ring completes the hermetical seal for the device.

REFERENCES:
patent: 4340902 (1982-07-01), Honda et al.
patent: 5021759 (1991-06-01), Gamand et al.

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