Microwave package laminate with extrusion bonded susceptor

Details Microwave package laminate with extrusion bonded susceptor Microwave package laminate with extrusion bonded susceptor

1991-11-12

1995-04-11

Robinson, Ellis P.

Stock material or miscellaneous articles

Hollow or container type article

Paper containing

428148, 428216, 428458, 428463, 428480, 428481, 428910, 383113, 383116, 426107, 426126, 426243, B65D 8500, B65D 8134, B65B 2908

Patent

active

054056632

ABSTRACT:
A laminate for use in microwave cooking which includes a susceptor formed by depositing a thin layer of microwave-interactive material on a plastic base sheet, and then extrusion bonding that susceptor to a plastic coated paper sheet, without the use of an adhesive.

REFERENCES:
patent: 4327136 (1982-04-01), Thompson et al.
patent: 4518651 (1985-05-01), Wolfe, Jr.
patent: 4735513 (1988-04-01), Watkins et al.
patent: 4765999 (1988-08-01), Winter
patent: 4851287 (1989-07-01), Hartsing, Jr.
patent: 4861957 (1989-08-01), Welles
patent: 4880695 (1989-11-01), Rudd et al.
patent: 4904836 (1990-02-01), Turpin et al.
patent: 4927991 (1990-05-01), Wendt et al.
patent: 4946743 (1990-08-01), Winter
patent: 4982064 (1991-01-01), Hartman et al.
patent: 4985606 (1991-01-01), Faller
patent: 5021293 (1991-06-01), Huarg et al.
patent: 5038009 (1991-08-01), Babbitt
patent: 5049714 (1991-09-01), Beresniewicz et al.
patent: 5059279 (1991-10-01), Wilson
patent: 5081330 (1992-01-01), Brandberg et al.
patent: 5147726 (1992-09-01), Suzuki et al.
patent: 5170025 (1992-12-01), Perry

Affiliated with

Also associated with

Rating

Microwave package laminate with extrusion bonded susceptor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microwave package laminate with extrusion bonded susceptor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microwave package laminate with extrusion bonded susceptor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1537145