Microwave integrated circuit package and method for forming...

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding

Reexamination Certificate

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C257SE23114

Reexamination Certificate

active

07968978

ABSTRACT:
A method for packaging a semiconductor device. The method includes: providing a dielectric layer over the semiconductor device; determining patterns and placement of material on the dielectric layer to provide a predetermined magnetic or electric effect for the device, such effects being provided on the device from such patterned and placed material solely by electrical or magnetic waves coupled between such material and the device; and forming the material in the determined patterns and placement to provide the predetermined effects.

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