Microstrip assembly

Details Microstrip assembly Microstrip assembly

1993-05-19

1994-11-08

Ham, Seungsook

Oscillators

Solid state active element oscillator

Significant distributed parameter resonator

333219, 333247, H03B 518, H01P 708

Patent

active

053630670

ABSTRACT:
A microstrip assembly (100), includes a first substrate such as a multilayer substrate (102, 106 and 112) having pockets or cavity areas (104). A second substrate (110) includes transmission lines (108) on its first surface, and a ground plane on its second surface which help form a microstrip resonator. The first and second substrates are attached with the transmission lines (108) resting inside of the areas defined by cavity areas (104). By providing an air gap on top of transmission lines (108), the microstrip assembly (100) can exhibit enhanced characteristics, while still maintaining the high Q characteristics of a microstrip.

REFERENCES:
patent: 4654694 (1987-03-01), Val
patent: 4801905 (1989-01-01), Becker
patent: 4953001 (1990-08-01), Kaiser, Jr. et ala.
patent: 4998077 (1991-03-01), Nanni et al.
patent: 5172077 (1992-12-01), Funada
patent: 5172303 (1992-12-01), Bernardoni
patent: 5227739 (1993-07-01), Mandai et al.

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