Microprocessor chip using two-level metal lines technology

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364488, 364489, 364490, G06F 1520, G06F 100

Patent

active

051650860

ABSTRACT:
A microprocessor chip including a ROM portion for storing a microprogram, an execution unit portion for executing an arithmetic operation and random logic circuits disposed between the ROM portion and the execution unit portion. Two-level metal lines technology is used for supplying power for grounding and for providing input/output interconnect lines for the random logic circuits.

REFERENCES:
patent: 3892957 (1975-07-01), Bryant
patent: 3987418 (1976-10-01), Buchanon
patent: 4319396 (1982-03-01), Law et al.
patent: 4393464 (1983-07-01), Knapp et al.
patent: 4447881 (1984-05-01), Brantingham et al.
patent: 4467409 (1984-08-01), Potash et al.
patent: 4568961 (1986-02-01), Noto
patent: 4583111 (1986-04-01), Early
patent: 4623911 (1986-11-01), Pryor
patent: 4652992 (1987-03-01), Mensch, Jr.
patent: 4742019 (1988-05-01), Bechade
patent: 4750026 (1988-06-01), Kuninobu et al.
patent: 4811073 (1989-03-01), Kitamura et al.
patent: 4951111 (1990-08-01), Yamamoto
Puri, Y. K., "Modified Weinburger Chip Image for Random Logic with Double Level Metallization", IBM Tech. Disclosure, vol. 19, No. 6, Nov. 1976, pp. 2148-2149.
Cook et al., Logic Circuit Design Methology and Applications, Apr. 4, 1979, pp. 333-346.
Feller et al., A 1.25--Micron CMOS-SOS DLM Optimized Standard Cell Technology, Jun. 21-22, 1984, pp. 290-297.
Song et al., Power Distribution Techniques for VLSI Circuits, Jan. 23, 1984, pp. 45-52.
Kang et al., Gate Matrix Layout of Random Control Logic in a 32-Bit CMOS CPU chip Adaptable to Evolve Logic Design, Jan. 1983, pp. 18-29.

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