Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-08-05
1994-05-03
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156633, 156656, 1566591, 156662, 156663, 156667, 156901, 29852, 29874, 437220, 257666, B44C 122, C03C 1500, C23F 100, H01L 21306
Patent
active
053084438
ABSTRACT:
Disclosed is a microprobe-provided circuit substrate for use as a probe assembly or the like, and a method for producing the same. The microprobes in the circuit substrate are constituted by pillar-shaped conductors provided in respective fine through holes formed in a base and having one ends projected out of the respective fine through holes. The circuit substrate having microprobes of such a structure as described above can be produced by the method for producing a microprobe-provided circuit substrate in which pillar-shaped conductors as precursors of microprobes are provided by an electroless plating method or the like in fine through holes formed in a base by a photographic method or the like, and then the microprobes are formed by projecting one ends of the respective pillar-shaped conductors out of a surface of the base by etching treatment or the like. Thus, it is possible to eliminate difficulties in fining microprobes, in positioning the respective microprobes accurately, in diversifying the arrangement of the microprobes, and the like, which are caused by the conventional process of producing a circuit substrate by manually fixing electrically conductive metals as precursors of microprobes at predetermined positions on a base.
REFERENCES:
patent: 3855692 (1974-12-01), Dugan
patent: 4411719 (1983-10-01), Lindberg
patent: 4916002 (1990-04-01), Carver
patent: 4926549 (1990-05-01), Yoshizawa et al.
patent: 4961052 (1990-10-01), Tada et al.
patent: 5103557 (1992-04-01), Leedy
Hoya Corporation
Powell William A.
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