Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Patent
1999-04-01
2000-04-04
Dutton, Brian
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
438 53, 7351421, 7351429, 7351432, H01L 2100, G01P 1500
Patent
active
060460679
ABSTRACT:
A micromechanical device contains, on a carrier or substrate (1, 10), a micromechanical region which is covered on the chip by a planar covering (D) arranged on the carrier. A method for the production of a micromechanical device of this type provides that a body is formed in which a first insulating layer (2, 11) is arranged on a carrier (1, 10) and a silicon layer (3, 12) is arranged over the insulating layer. The silicon layer (3, 12) is structured, openings (L, LS) being formed down to the first insulating layers. An insulating layer region (IS, 13) and a planar further layer (P, 14) are applied. The further layer (P, 14) is structured, openings being formed down to the insulating layer region (IS, 13). The insulating layer region and the regions of the first insulating layer which are situated underneath it are selectively etched, and a covering layer is applied over the further layer as a planar covering (D). The device can be mounted in a plastic housing without a clean room atmosphere.
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Dutton Brian
Siemens Aktiengesellschaft
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