Micromechanical device

Details Micromechanical device Micromechanical device

2006-07-18

2006-07-18

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S415000, C257S414000, C438S050000

Reexamination Certificate

active

07078778

ABSTRACT:
A micromechanical device comprises a substrate and a member which is moveably attached to the substrate, wherein the member is formed in an electrically conductive layer, wherein a first area of the moveable member forms a first electrode, a second area of the moveable member forms a second electrode, and wherein the first electrode and the second electrode are electrically insulated from each other by an electrically insulating third area which penetrates the conductive layer, and wherein the substrate comprises a third electrode which is at least partially arranged opposed to the first electrode and the second electrode.

REFERENCES:
patent: 6188504 (2001-02-01), Murakami et al.
patent: 6470110 (2002-10-01), Lin
patent: 6661637 (2003-12-01), McIntosh et al.
patent: 6734512 (2004-05-01), Suzuki
patent: 6734762 (2004-05-01), Cornett et al.
patent: 2002/0145493 (2002-10-01), Wang
patent: 2002/0149072 (2002-10-01), Mutoh et al.

Affiliated with

Also associated with

Rating

Micromechanical device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Micromechanical device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micromechanical device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3526373