Micromechanical component with a switch element as a movable str

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation

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257419, H01L 2982

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active

056379048

ABSTRACT:
A micromechanical component includes a fixed micromechanical structure having at least two electrodes being formed of one or more conductive layers, and a movable micromechanical structure in a void or chamber forming a conductive switch element, for making an electrical contact between the electrodes with the aid of the switch element. The void or chamber can have a, for example, grid-shaped device for securing the switch element against falling out and/or a seal at the top. A microsystem with an integrated circuit and the micromechanical component, as well as a production process for the component and the microsystem, are also provided. The component and the circuit can therefore be produced simultaneously in a very simple manner.

REFERENCES:
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IEEE Publ. CH2957-9/91 (Guckel et al.), pp. 74-79, "Fabrication of Assembled Micromechanical Components . . . ".
IBM Technical Discl. Bulletin, vol. 30, No. 6, Nov. 12, 1987, p. 393, "Three-Terminal Latching Micro . . . ".
IEEE Transducers 91 Publ. (Chen et al.), pp. 739-742, "A Selective CVD Tungsten Process for Micromotors".
Elsevier Science Publishers Microelectronic Eng. 13 (1991) 509-512 (Bley et al.), "Description of Micro. . . ".
Elsevier Sequoia Publication 1992 (Tavrow et al.), pp. 33-43, "Operational characteristics of microfabricated".
IOP Publ. 1991 (Mehregany et al.), pp. 73-85, "Surface micromachined mechanisms and micromotors".
IEEE Publication Jun. 22-25, 1992, pp. 126-131, "Solid-State Sensor and Actuator".

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