Micromechanical component and suitable method for its...

Details Micromechanical component and suitable method for its... Micromechanical component and suitable method for its...

2007-08-28

2007-08-28

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S050000, C438S694000, C257S252000, C257S414000

Reexamination Certificate

active

11343613

ABSTRACT:
A micromechanical component having a substrate conductive in at least some regions; an elastically deflectable diaphragm, which is conductive in at least some regions, arches over a front side of the substrate, and is electrically insulated from the substrate, the diaphragm having an inner region (I; I′) and an edge region (RB; RB′); and a hollow space (H), which is provided between the substrate (1) and the diaphragm (M); the inner region (I; I′) having a cross-section that is modified in comparison with the edge region (RB; RB′), which means that the bending of the inner region (I; I′) is less than that in the case of an identical cross-section.

REFERENCES:
patent: 6204080 (2001-03-01), Hwang
patent: 6210988 (2001-04-01), Howe et al.
patent: 2002/0006682 (2002-01-01), Benzel et al.
patent: 42 41 045 (1994-05-01), None

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