Micromechanical component and process for the fabrication thereo

Details Micromechanical component and process for the fabrication thereo Micromechanical component and process for the fabrication thereo

1995-04-27

1997-10-14

Ngo, Ngan V.

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

257415, 257417, 257419, 437 62, 437901, H01L 2982

Patent

active

056775601

ABSTRACT:
A micromechanical component having a carrier and a deformable element of a flat design disposed parallel to a surface of the carrier, with the deformable element being provided with a mechano-electric signal converter. The carrier and the deformable element are fabricated in one piece out of a semiconductor substrate and are electrically insulated from one another, with the insulation being obtained by a buried layer produced by ion implantation thereby providing a micromechanical component which is suitable for joint integration with electric circuits in CMOS technology.

REFERENCES:
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patent: 4524247 (1985-06-01), Lindenberger et al.
patent: 4665610 (1987-05-01), Barth
patent: 4721938 (1988-01-01), Stevenson
patent: 4744863 (1988-05-01), Guckel et al.
patent: 5006487 (1991-04-01), Stokes
patent: 5080730 (1992-01-01), Wittkower
patent: 5095349 (1992-03-01), Fujii et al.
patent: 5196355 (1993-03-01), Wittkower
patent: 5310689 (1994-05-01), Tomozane et al.
Benjamin, "Micromachining of Silicon by Selective Anodisation", Dec. 1986, p. 23 to 43.

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