Micromechanical component and method for producing the same

Details Micromechanical component and method for producing the same Micromechanical component and method for producing the same

2006-06-20

2006-06-20

Hassanzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Etching of semiconductor material to produce an article...

C216S036000, C257S414000

Reexamination Certificate

active

07063796

ABSTRACT:
A method of manufacturing a micromechanical component has a substrate (1), a movable sensor structure (6) in a micromechanical functional layer (5) located over the substrate; a first sealing layer (8) on the first micromechanical functional layer (5) which is at least partly structured; a second micromechanical functional layer (10) on the first sealing layer (8), which has at least one sealing function and is anchored at least partly in the first micromechanical functional layer (5); and a second sealing layer (8) on the second micromechanical functional layer (10). The sensor structure (6) is provided with trenches (7) whose width is not larger than a maximum trench width (66), which is sealable by the first sealing layer (8) in the form of plugs (9) which do not extend to the trench bottoms.

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Kniffin M. L., et al, “Packaging for Silicon Micromachined Accelerometers,” International Journal of Microcircuits and Electronic Packaging, International Microelectronics & Packaging Society, U.S. Bd. 19, Nr. 1, 1996, pp. 75-86.

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