Micromechanical component and method for producing the same

Details Micromechanical component and method for producing the same Micromechanical component and method for producing the same

2006-05-09

2006-05-09

Hassanzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Etching of semiconductor material to produce an article...

Reexamination Certificate

active

07041225

ABSTRACT:
A method of manufacturing a micromechanical component having the following steps is described: providing a substrate (1); providing a first micromechanical functional layer (5) on the sacrificial layer (4); structuring the first micromechanical functional layer (5) in such a manner that it is provided with a mobilizable sensor structure (6); providing and structuring a first sealing layer (8) on the structured first micromechanical functional layer (5); providing and structuring a second micromechanical functional layer (10) on the first sealing layer (8) which has at least a covering function and is at least partially anchored in the first micromechanical functional layer (5); making the sensor structure (6) movable and providing a second sealing layer (8) on the second micromechanical functional layer (10). A corresponding micromechanical component is also described.

REFERENCES:
patent: 4665610 (1987-05-01), Barth
patent: 5760455 (1998-06-01), Hierold et al.
patent: 195 09 868 (1996-09-01), None
patent: 195 37 814 (1997-04-01), None
patent: 0 001 038 (1979-03-01), None
C Liu et al.: “Sealing a Micromachined Cavities Using Chemical Vapor Deposition Methods: Characterization and Optimization” Journal of Microelectromechanical Systems, IEEE Inc. New York, US, vol. 8, No. 2, pp. 135-145*.
Y B Ning et al.: “Fabrication of a silicon micromachined capacitive microphone using a dry-etch process” Sensors And Actuators A, CH, Elsevier Sequoia S.A., Lausanne, vol. 53, No. 1, pp. 237-242*.
A Partridge et al.: “New thin film epitaxial polysilicon encapsulation for piezoresistive accelerometers” Technical Digest. MEMS 2001. 14thIEEE International Conference on Micro Electro Mechanical Systems (CAT. No. 01CH37090), Technical Digest MEMS 2001. 14thIEEE International Conference on MEMS. Interlaken. Ch. 21-25, pp. 54-59*.

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