Micromechanical component and method for producing a...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation

Reexamination Certificate

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Details

C257SE29324, C257SE21214, C257SE23145, C438S053000

Reexamination Certificate

active

08076739

ABSTRACT:
A micromechanical component includes a substrate that has a front side and a backside, the front side having a functional pattern, which functional pattern is electrically contacted to the backside in a contact region. The substrate has at least one contact hole in the contact region, which extends into the substrate, starting from the backside.

REFERENCES:
patent: 5511428 (1996-04-01), Goldberg et al.
patent: 6468889 (2002-10-01), Iacoponi et al.
patent: 2004/0104454 (2004-06-01), Takaoka et al.
patent: 2005/0133880 (2005-06-01), Benzel et al.
patent: 2006/0205211 (2006-09-01), Kirby
patent: 100 32 579 (2002-01-01), None
patent: 103 23 559 (2004-12-01), None
patent: 103 59 217 (2005-07-01), None
patent: 10 2005 053 861 (2007-05-01), None

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