Micromechanical component and manufacturing method

Details Micromechanical component and manufacturing method Micromechanical component and manufacturing method

2011-04-05

2011-04-05

Tran, Long K (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S048000, C438S049000, C257S414000, C257S415000, C257S416000

Reexamination Certificate

active

07919346

ABSTRACT:
A micromechanical component has a substrate, a first intermediate layer which is situated thereupon, and a first layer which is situated thereupon and is structured down to the first intermediate layer. A second intermediate layer is situated above the first layer. A second layer is situated on the former, at least one movable micromechanical structure being structured into the second layer. The second intermediate layer is removed in a sacrificial zone beneath the movable micromechanical structure and the first intermediate layer is partially removed in zones beneath the first layer. The movable micromechanical structure is provided with at least one stop surface on a bottom face, this stop surface being contactable with a zone of the first layer which is supported by the first intermediate layer by deflection of the movable micromechanical structure. A method for producing such a micromechanical component is also described.

REFERENCES:
patent: 5501893 (1996-03-01), Laermer et al.
patent: 5679436 (1997-10-01), Zhao
patent: 5756901 (1998-05-01), Kurle et al.
patent: 6679995 (2004-01-01), Banjac et al.
patent: 6876048 (2005-04-01), Fischer et al.
patent: 6936491 (2005-08-01), Partridge et al.
patent: 2002/0127822 (2002-09-01), Ueyanagi et al.
patent: 2004/0187592 (2004-09-01), Sugiura
patent: 2007/0222006 (2007-09-01), Weber et al.
patent: 4241045 (1994-05-01), None
patent: 19537814 (1997-04-01), None
patent: 1228998 (2002-08-01), None
patent: WO 01/44822 (2001-06-01), None
International Search Report, PCT International Patent Application No. PCT/EP2006/069044, dated Mar. 28, 2007.

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